Conceptronic Technical Paper Abstract

Title: Rework Process for Chip Scale Components

Author: Stanley Kench, Conceptronic, Inc.

Abstract:

The materials and processing issues associated with BGA and Chip Scale packages are discussed. Next, the technical challenges involved with designing semi-automatic single-site soldering/rework stations for this application are discussed. Finally, a soldering/rework process methodology is presented.

Note: Originally presented at the 1996 SMI Trade Conference in San Jose, California