Conceptronic Technical Paper Abstract

Title: Temperature Measurement and Profile Derivation in a Reflow Soldering Oven

Author(s): Dr. Paul Rothe, Creare, Inc., Stephen Dow, Conceptronic, Inc. and Robert Silveri, Conceptronic, Inc.

Abstract:

Thermocouple (TC) usage and operating fundamentals are reviewed. Uncertainty factors associated with the use of thermocouples for device/solder interface temperature profiling are then discussed. Test results are then presented which demonstrate the degree of temperature accuracy possible with the use of various thermocouple types and surface attachment methods. Finally, the many interactive factors associated with product thermal profile derivation in the reflow soldering process are discussed along with strategies for thermal efficiency assessment in SMT reflow ovens.

NOTE: Originally presented at the 1996 Nepcon West Technical Conference